Welcome Message from the Technical Program Committee Chairs

On behalf of the Technical Program Committee (TPC), it is our great pleasure to welcome you to the 2026 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and Terahertz Applications (IMWS-AMP) in the beautiful city of Cairns, Australia.

Acknowledgements and Appreciation We sincerely thank all authors for submitting their high-quality work to this year's workshop. The technical depth of your submissions is the foundation of this event. We also extend our deepest appreciation to our dedicated reviewers and committee members for meticulously vetting the papers and maintaining the high standards of the IEEE MTT-S community.

Acceptance and Global Diversity IMWS-AMP 2026 has drawn a strong response from the global scientific community. Out of 168 submissions, 146 papers were accepted for the final Program after a rigorous peer-review process. To ensure a comprehensive and dynamic technical exchange, these accepted papers have been carefully curated into the following categories:

• 104 Regular Session Papers, showcasing the latest peer-reviewed advancements across our core technical tracks.
• 22 Invited Papers, featuring insights from distinguished experts in the field.
• 12 Semi-Plenary Papers, offering broad, impactful perspectives on critical microwave and terahertz challenges delivered by IEEE Fellows.
• 8 TC-17 Workshop Papers, providing specialised, in-depth discussions on targeted technologies and applications.

The program is strengthened by 3 Keynotes from leading figures in the field. We are proud to welcome authors from 26 different countries and regions, representing a truly international bridge for knowledge sharing across the Asia/Pacific, Europe, the Americas, the Middle East, and Africa.

Technical Program Excellence This year's Program smoothly weaves together materials science with practical circuit and antenna architectures. The core MTT disciplines are excellently represented:

• Advanced Materials & Manufacturing: Breakthroughs in 2D materials, flexible substrates, 3D printing, and advanced packaging.
• Intelligent Wave Engineering: Comprehensive sessions on programmable metasurfaces, metamaterials, and antennas.
• Integrated Front-Ends & Systems: Cutting-edge research in CMOS/BiCMOS power amplifiers, wireless power transfer, biomedical sensing, and terahertz communications.

We hope you find the Keynote Speeches, Semi-Plenary talks, and Special Sessions highly inspiring, and that you take time to network, forge new partnerships, and experience the magnificent natural wonders of Cairns.

With warm regards,

Technical Program Committee Chair

Withawat Withayachumnankul, The University of Adelaide

Technical Program Committee Co-Chairs

Konstanty Bialkowski, The University of Queensland, Australia Si-Ping Gao, Nanjing University of Aeronautics and Astronautics, China Zhihao Jiang, Southeast University, China Amir Ebrahimi, RMIT, Australia Naixing Feng, Anhui University, China Wenjie Feng, South China University of Technology, China He Zhu, Commonwealth Scientific and Industrial Research Organisation (CSIRO), Australia